一、Cu pillar Bumping

App. :Fine pad pitch Cu pillars on 12inch wafer

二、Lid Heat Spreader 散热盖

Application : Heat Spreader for Flip Chip package, Memory module

三、CNT-TIM

四、Glass-to-Metal Seals (GTMS)

・GTMS for LD Device/LD Light Source 

・CAN PKG for Opt. Communication

・GTMS for Initiator

Application : LD (Laser Diode), LED, Sensors, etc.

五、Motor Core

Application :

Motors for industrial equipment, Motors

for EV (Electric Vehicle) and HV (Hybrid Vehicle)

六、有机复合材料

七、Materials for Sensor

八、PBN（热解氮化硼）加热器